预处理浸泡对聚酰亚胺重离子微孔膜蚀刻的影响

梁海英; 鞠薇; 吴振东; 焦学胜; 陈东风; 傅元勇

doi:10.11889/j.0253-3219.2017.hjs.40.010501

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预处理浸泡对聚酰亚胺重离子微孔膜蚀刻的影响

核物理、交叉学科研究 | 更新时间：2021-05-19

- 预处理浸泡对聚酰亚胺重离子微孔膜蚀刻的影响
- Effect of soaking on etching of polyimide heavy-ion microfiltration membranes
- 核技术 2017年40卷第1期文章编号：010501
- 作者机构：
  
  中国原子能科学研究院北京 102413
- 作者简介：
  
  [ "梁海英, 女, 1983年出生, 2011年于中国原子能科学研究院获硕士学位", "LIANG Haiying, female, born in 1983, graduated from China Institute of Atomic Energy with a master’s degree in 2011" ]
- 基金信息：
  
  国家自然科学基金资助(No.11475267)
- DOI：10.11889/j.0253-3219.2017.hjs.40.010501
  中图分类号： TL99
- 收稿日期：2016-07-05，
  
  修回日期：2016-11-03，
  
  纸质出版日期：2017-01
- 稿件说明：
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梁海英, 鞠薇, 吴振东, 等. 预处理浸泡对聚酰亚胺重离子微孔膜蚀刻的影响[J]. 核技术, 2017,40(1):010501

Haiying LIANG, Wei JU, Zhendong WU, et al. Effect of soaking on etching of polyimide heavy-ion microfiltration membranes[J]. Nuclear techniques, 2017, 40(1): 010501
梁海英, 鞠薇, 吴振东, 等. 预处理浸泡对聚酰亚胺重离子微孔膜蚀刻的影响[J]. 核技术, 2017,40(1):010501 DOI： 10.11889/j.0253-3219.2017.hjs.40.010501.

Haiying LIANG, Wei JU, Zhendong WU, et al. Effect of soaking on etching of polyimide heavy-ion microfiltration membranes[J]. Nuclear techniques, 2017, 40(1): 010501 DOI： 10.11889/j.0253-3219.2017.hjs.40.010501.

摘要

聚酰亚胺（Polyimide，PI）膜是一种新型的有机膜，具有耐高温、耐强酸和耐辐射等特性，用其制备的重离子微孔膜可以用于电池隔膜和放射性废气过滤等特殊领域。应用中国原子能科学研究院HI-13串列加速器产生的重离子束

S离子轰击25μm的PI薄膜，再对薄膜进行化学蚀刻处理，使由重离子辐照损伤产生的径迹形成微孔。为改善微孔质量，在化学蚀刻前采用具有强氧化性溶液对PI膜进行预处理浸泡，系统分析了常温下采用高锰酸钾和双氧水两种溶液浸泡不同时间对PI膜化学蚀刻的影响。实验结果显示，预处理浸泡可明显加快PI膜的径迹蚀刻速率，缩短蚀刻时间，减小微孔的锥角和提高PI重离子微孔膜的蚀刻质量。

Abstract

Background:

Polyimide (PI) film is a new type of organic film possessing properties of high temperature resistance

acid resistance and radiation resistance

etc

. The heavy-ion microporous membrane prepared by polyimide film can be used for battery diaphragm

radioactive waste gas filtering and other special areas.

Purpose:

This study aims to improve the quality of PI heavy-ion micro-filtration membrane by soaking pretreatment.

Methods:

First of all

25-μm PI films were irradiated by

S ions produced by HI-13 tandem accelerator in China Institute of Atomic Energy to break the polymer chains. Latent tracks were created along the track of the ions. Then soaking pretrestment with two types of strong oxidizing solutions

i.e.

potassium permanganate and hydrogen peroxide

was conducted before the chemical etching processing to form the micropores. Finally

etching time and the quality of micropores were compared and analyzed.

Results:

The etching rate for PI film pre-processed by soaking in potassium permanganate solution and hydrogen peroxide solution for 2 h are 1.6 times and 1.3 times respectively

compared with that no soaking pretreatment at normal temperature. More narrow cone angle is formed for faster etching rate.

Conclusion:

The experimental results showed that soaking pretreatment can obviously increase the track etching rate of PI membrane

decrease etching time

narrow the cone angle of pores and improve the quality of PI heavy-ion microporous membrane.

关键词

Keywords

references

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