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北京师范大学低能核物理研究所
纸质出版日期:1994-01-01
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[1]张通和,陈俊,杨建华,张荟星,丁晓纪.脉冲注入中靶温对金属间化合物生成的影响[J].核技术,1994(01):7-12.
Influence of target temperature on metallic compound growth for puled ion implantation[J]. Nuclear techniques, 1994, (1).
研究了在钢和Al中脉冲注入Ti和Mo的条件下金属间化合物形成的规律及生长机理,给出了金属间化合物生长与靶温的关系,得出的实验结果与计算相符合。与电镜中退火原位观察结果比较发现,注入过程中金属间化合物生长温度(400℃)比退火中金属间化合物生长温度(600℃)低得多,说明注人过程中空位流和间隙原子流能促进金属间化合物的生长。通过脉冲注入已得到十余种金属化合物和金属间化合物,这些化合物的出现提高了注入层的硬度,改善了抗磨损特性。
Growth of metallic compounds during the pulsed Ti or Mo ion implantation into steel and Al is studied experimentally and theoretically. The relation of the compound growth law with target temperature rise is given. A comparison of the results of pulsed ion implantation with the in situ TEM observation shows that the growth temperature during implantation (400℃ ) is much lower than that during annealing(600℃ )
which indicates that the flux of vacancies and interstitials can promote the growth of metallic compounds. More than ten kinds of the compounds have been obtained using MEVVA ion implantation. Because the compounds are formed in the implanted layer
hardness of the implanted layer increases and the wear property is umproved.
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