采用的同步辐射 X 射线波长范围应该为 0.2—0.4 nm。探讨了在北京同步辐射 3B1A 光刻束线上进行 50nm X 射线光刻的可能性。
Abstract
Compared to other Next Generation Lithography ( NGL) techniques
X-ray lithography has many ad- vantages
such as large process latitude
high throughput
extremely long depth of focus
large exposure field sizes
and low cost
and the more important thing is that X-ray lithography technology is relatively mature. For 100 nm resolution synchrotron radiation X-ray lithography system
its wavelength is in the range of 0.7—1.0 nm; and when the resolution is below 50 nm
its wavelength should be in 0.2 nm to 0.4 nm. In this paper
the possibility of designing a 50 nm resolution X-ray lithography system for Beijing Synchrotron Radiation Facility 3B1A beamline is discussed.