Because of its many merits

such as high resolution

large depth of focus

large field size

high throughput

large process latitude

easy extendibility to 50 nm and below ground rule

and so on

the Proximity X-ray Lithography (PXL) is very attractive for the 100 nm and smaller ground rule integrated circuit manufacturing. In this paper

the international research and development status of PXL is briefly introduced firstly

and both its application status and prospect in nanoelectronics research

Monolithic Microwave Integrated Circuits (MMIC) production and silicon-based Ultra Large Scale Integrated Circuits (ULSIC) production are described

and the recent research progress in home PXL is also presented briefly.