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信阳师范学院物理电子工程学院
Published:01 November 2010
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[1]陈长春,刘江锋,余本海,王林.MOCVD制备的氮化铪薄膜结构特性研究[J].核技术,2010,33(11):836-838.
CHEN Changchun LIU Jiangfeng YU Benhai WANG Lin. Structural characteristic of HfN_x films fabricated by MOCVD[J]. Nuclear techniques, 2010, 33(11): 836-838.
以热氧化的p型硅(SiO2/Si)为衬底
运用金属有机化学气相淀积(MOCVD)技术以铪基金属有机源和高纯氨为反应气体在其上淀积HfNx薄膜样品。薄膜结构信息用RBS技术、XRD技术及X射线反射率(XRR)计等来表征。实验结果表明
HfNx薄膜中N与Hf原子组分比为1.15;薄膜为多晶薄膜且沿(111)方向择优生长;薄膜表面平整
与衬底界面粗糙度小。
HfNx sample was grown on SiO2/Si substrate by metal organic chemical vapor deposition(MOCVD).Rutherford backscattering spectrometry(RBS)
X-ray powder diffraction(XRD) and X-ray reflectivity(XRR) were used to characterize the HfNx thin film.The results showed that the ratio of N atoms to Hf atoms in the HfNx thin film was around 1.15
and the HfNx thin film
with a smooth surface and an interface of small roughness on the substrate
was a polycrystalline thin film grown preferentially along the(111) crystal direction.
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