WEI Mengfu XIAN Xiaobin LIU Jidong. A study on nondestructive measurement method of the Al plating thickness on U matrix[J]. Nuclear techniques, 2001, (8): 655-662.
WEI Mengfu XIAN Xiaobin LIU Jidong. A study on nondestructive measurement method of the Al plating thickness on U matrix[J]. Nuclear techniques, 2001, (8): 655-662.DOI:
A study on nondestructive measurement method of the Al plating thickness on U matrix
The interaction between primary X-ray with Al plating and U matrix materials
characteristic X-ray with Al plating thickness and the effect of U matrix’s radioactivity on measurement of Al thickness has been discussed. A mathematical model of the relationship between intensity and plating thickness has been developed. UM or UL X-ray has been selected by the model to measure the thin or thick samples respectively. A measuring method of Al plating thickness (8.2-55.5μm) on U matrix has been established. The precision is better than 3% for 8.2-18μm samples and better than 5% for 18-55.5μm samples.