GUO Hongxia~1 HAN Fubin~1 CHEN Yusheng~1 XIE Yaning~2 HUANG Yuying~2 HE Wei~2 HU Tiandou~2 WEI Ning~3 YU Lunzheng~3 1. Research on secondary package shielding of hard X-rays for integrated circuits[J]. Nuclear techniques, 2004, (12): 968-970.
GUO Hongxia~1 HAN Fubin~1 CHEN Yusheng~1 XIE Yaning~2 HUANG Yuying~2 HE Wei~2 HU Tiandou~2 WEI Ning~3 YU Lunzheng~3 1. Research on secondary package shielding of hard X-rays for integrated circuits[J]. Nuclear techniques, 2004, (12): 968-970.DOI:
Research on secondary package shielding of hard X-rays for integrated circuits
On the basis of study of X-ray dose enhancement effect for integrated circuits
hardening technology of secondary package shielding is proposed for typical devices. In the paper
Monte Carlo method was used for calculating the shielding effect. It has been proven that the shielding with high Z material (e.g. tungsten
tantalum) as package stuff is effective against X-ray according to the simulation results
the secondary package technology can therefore be adopted for typical semiconductor devices. Using the established test setup
an experiment on validation of this technology was made on BSRF. SRAM 62256 with different thicknesses of package material is chosen in the experiment. Tolerance X-ray dose for the IC is found to increase by one order of magnitude. The established method is very important for improving the hardening level of IC.