molecular dynamics simulation method was used to investigate the interactions of 10 eV F ions continuously bombarding SiC surface with incident angles of 15?
30?
45?
60? and 75?.The simulation results show that the deposition rate of F decreases with increasing incident angle.It is found that when the incident angle is 45?
the etching rates of Si and C atoms reach the maximum values.The etching rate of Si atoms is greater than that of C atoms.A Si-C-F reactive layer is formed after the F ions interaction with SiC surface.The thickness of Si-C-F layer decreases with increasing incident angle
and the formation of Si-C-F layer are primarily SiF and CF.