自1977年以来,为了摸索离子注入半导体的新退火方法,各国学者进行了大量的研究工作。这种努力是从激光退火的研究开始的。激光与半导体材料相互作用的研究,已派生出若干很有生命力的应用项目,其中,快速热退火、SOI(Semiconductor on Insulator)技术等已显示了重要的应用前景,并正在走向实用化。
Abstract
New annealing methods of ion implanted semiconductors can be broadly classified into three categories: adiabatic annealing
thermal flux annealing and rapid thermal annealing. In recent years
by using these methods
we have been investigating laser annealing of ion implantation damage
laser alloying to the formation of an ohmic contact between GaAs and AuGeNi
and laser recrystallization of polyerystalline semiconductor films on insulating substrates. In this paper
we focus on the discussion of rapid thermal annealing of BF
2
+
implanted Si using RF graphite heater and CW Ar
+
laser recrystallization of InP films on oxidized Si substrate.
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references
J. M. Poate and J. W. Mayer ed. , Laser annealing of semiconductors , Academic Press , New York , 1982 .
邹世昌 和 林成鲁 , 物理学报 , 31 , 1033 ( 1982 )。
林成鲁 等 , 中国激光 , 12 , 722 ( 1985 )。
J. С. С. Fan and N. M. Tohnson ed. , Energy beam-solid interactions and transient thermal processing , North-Holland , 1984 , p. 621 .